Field modules

Gateway de diagnóstico Cube 67 - Murrelektronik

IO-Link modules MVK and Impact67 – Murrelektronik

MKV Metal and Impact67 IO-Link fieldbus modules take you directly to where you want to go. They are ideal for integrating IO-Link devices into installation solutions. The advantages: fast integration, brief commissioning times, yet maximum flexibility.
The basic feature of this easy integration is 'IODD On Board', an innovative technology by Murrelektronik. The sensor and actuator parameter data stored in the IODD (IO Device Description) are directly incorporated into the GSDML files of the Murrelektronik MVK Metal and Impact67 fieldbus modules. If these devices, for example IO-Link sensors or valve terminals, are connected, you can access this stored data directly and very conveniently via your control software, with no need for manual parameter setting or special tools.
 

Modular distributed I/O Cube67 - Murrelektronik

New standards in automation technology.

Cube67 from Murrelektronik is the modular, distributed I/O system that uniquely combines IP20 and IP67 protection - plug-connected, robust, fully encapsulated. Starting at the bus coupler, the I/O layer spreads radially throughout the application. The hybrid system cable connections for power supply and communication between individual components in the system are rational and clear: Assemble - plug in - that's it! 
 

PROFINET/PROFIsafe Fieldbus module MVK Fusion - Murrelektronik

What makes the MVK Fusion fieldbus module unique is its variety. It combines three basic functions: standard digital sensors and actuators, safety digital sensors and actuators and IO-Link. This combination is new and innovative. It enables unique and groundbreaking automation concepts to be realized. Installation becomes simpler and faster.
 
 

SOLID67 – Murrelektronik

SOLID67 are the new compact I/O modules from Murrelektronik. They make installation in the field easier and are very attractive for applications with IO-Link sensors and actuators. They provide eight IO-Link slots directly adjacent to the process and can easily incorporate classic IOs into the system.
 
Full encapsulation and impressive vibration and shock values (15 and 50 G) prepare the modules for use in harsh industrial environments – within a temperature range of −20 to +70°C. This opens a door to numerous applications. Comprehensive diagnostic options at the module, through the control unit, and through an integrated web server, make troubleshooting a simple exercise.
 
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